Technology

The World-Leader in Particle-Free Conductive Inks

Particle-Free Metal Complex Conductive Inks

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High-performance

Pure metallic films with no binders result in plated-metal properties.

Particle-Free

Excellent ink stability, printing yield, and film reliability at low cost.

Product Details

Higher Conductivity Than Nanoparticle Inks

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Ability To Print on 3D Surfaces

 

  • Capability to print conductive ink on 3D surfaces, such as around edges of thin glass for µLED and mini LED
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EMI and RF Shielding

  • Spray Coating for On-Chip EMI Shielding Information Sheet
  • CircuitshieldTM package level shielding
  • Traditionally, metal lid (casing) has been the main shielding material
  • The industry is moving towards package level shielding to enable more SiP, AoP, 5G and more functionality in devices
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Cabling

  • Ability to directly metalize conventional data cables and wires to provide exceptional shielding properties and low-loss data transfer
  • Compatible with common dielectric materials
  • Low-curing temperature
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Micro LED, Mini LED, OLED, LCD Displays

  • Developed inks and methods for both inkjet and screen printing to lay down high-performance electrodes around the edge of display glass
  • Electrodes, reflectors and bond pads for these display applications

Reflective Surfaces & Reflective Films

  • LightguideTM for OLED, LCD, VR and AR displays
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Touch Panels

  • Film (PET, COP, PC, PI, etc.)
  • Inorganic surfaces (glass, ITO, Si, SiO, SiN)
  • Elastomers (PU, vinyl, etc.)
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E-textiles

  • Fabric (natural including cotton, wool, silk, etc.; man-made including polyesters, non-wovens, lycra, etc.)
  • Metallized fabric / direct metal embedding
  • Stretchable display prototyping

In addition, due to the particle-free nature of our conductive inks, it is readily absorbed into fabric and fibers to metallize them at the nanoscale. This truly enables stretchable electronics and a new class of intrinsically conductive e-textiles.

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Polyester fabric dyed with CircuitTex conductive ink

Interconnects and Bond Pads

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Metallization

  • Small pattern metallization (down to 20 nm)
  • 5G/RF and 3D antenna
  • Our films are pure metal
    • Catalytically active – electroless plating is feasible (1-10 microns of copper or nickel)
    • Highly conductive – can be directly electroplated (>10 microns of any metal)
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Via Fill

  • Ability to metallize via walls, or plug vias completely
  • Through vias and blind vias
  • Tapered or non-tapered via walls
  • Substrate type: PI, glass, COP, etc.
  • Via dimensions: Width from 20 nm up to 400um; Depth from 100 nm to 700um
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